Thin film type magnetic connector module

ABSTRACT

Various disclosed embodiments generally relate to connector modules, and more particularly to magnetic connector modules. The connector module includes a board having a concave section formed at a first side, and the concave section has a base surface having formed thereon a plurality of first electrodes. A plurality of second electrodes are formed at a second side of the board opposite the first side and on a rear surface facing away from the base surface. A plurality of holes are formed through the concave section and have conductors formed therethrough to electrically connect the first electrodes and the second electrodes. The connector module additionally includes a magnet inserted into the concave section and an insulating layer interposed between the magnet and the first electrodes.

INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/483,487, filed Apr. 10, 2017, which is a continuation of U.S. patentapplication Ser. No. 14/948,724, filed Nov. 23, 2015, now U.S. Pat. No.9.620,893, which claims priority to Korean Patent Application No.20-2014-0008618, filed on Nov. 25, 2014. The disclosure of each of theabove is incorporated herein by reference in its entirety.

BACKGROUND Field

The disclosure generally relate to connector modules, and moreparticularly to magnetic connector modules.

Description of the Related Art

Various connectors are used to connect electronic devices to, e.g.,supply power to the electronic devices and to transfer data to andbetween the electronic devices, and various types exist.

Many connectors employ insertion methods of connection betweenconnection points, e.g., from a socket to an electronic device, e.g.,portable electronic devices such as a smart phone, a tablet computer,etc. Many connectors also employ a wire between the connection points.Some of these connectors are often inconvenient to use because of thepresence of the wire, and repeated usage of such connectors may causedamage to the connection points. For example, sockets can be damagedfrom repeated connecting and disconnecting processes. In addition, someconnection points in portable electronic devices may add to the size andweight of the devices. Furthermore, while wireless connections may besuitable for some connection purposes, such as data communications, theymay not be practical for other connection purposes, e.g., efficient andhigh speed power delivery. Thus, there is a need for connectors that donot suffer from these undesirable aspects of existing connectors such aswire-based connectors, while simultaneously not suffering fromundesirable limitations of wireless connections.

SUMMARY

Various embodiments disclosed herein aim to solve the aforementionedproblems of some of the existing connector technologies, by providing athin magnetic connector module, and providing magnetic connector modulesthat can be connected easily to various devices. In some embodiments,the magnetic connector modules are thin film-type magnetic connectormodules.

In order to resolve the aforementioned problems, in some embodiments,the thin film-type magnetic connector module, as a board capable offorming electrodes on the surface, is equipped with the aforementionedboard with a concave section built internally, is equipped withelectrode sections composed of multiple electrodes on the aforementionedother side of the board and the base surface, and includes: a board holeto connect the electrode sections at the base surface of the concavesection and on the other side of the board; a magnet to be inserted intothe aforementioned concave section; and a coating layer for insulatingbetween the electrode sections built on the aforementioned magnet andthe base surface.

The thin film-type magnetic connector module according some embodimentshas a concave section is formed on one side of the aforementioned board,and can also include a connection socket connecting with the electrodesection built on the aforementioned base surface.

Some embodiments of the thin film-type magnetic connector are built as asingle body on the aforementioned board and can be expanded on one sideof the board, and can also include a wing section that can be builtseparately from the board and attached to a single surface of the board.

In this instance, the wing section is made of metal materials andattached to the aforementioned board, and covers the magnet beinginserted into the aforementioned concave section.

Also, the embodiments can include a metal plate that covers the magnetbeing inserted into the aforementioned wing section and the concavesection.

Also, the aforementioned wing section is equipped with holes.

In this instance, the holes are equipped in order to createcircumferential symmetry with the center of the aforementioned concavesection being the center standard.

Also, the electrode section built on the other side of theaforementioned board is made up of pattern electrodes in a concentriccircular shape.

In accordance with some embodiments, a magnet is inserted in the concavesection on a surface on the board, and by forming an electrode sectionon the other side of the board, electric connection is made with anexternal device through magnetism between the aforementioned electrodesection and the external socket section, and is able to provide a verythin magnetic connector module.

Also, in accordance with some embodiments, a wing section is built onone surface of the board, and by forming holes on the wing section; thethin film-type magnetic connector module disclosed herein is configuredto be easily attached to various devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a thin film-type magnetic connectormodule according to various embodiments.

FIG. 2a is a cross-sectional view of a magnetic connector moduleaccording to some embodiments, where the cross-section is taken alongline A-A′ of a thin film-type magnetic connector illustrated in FIG. 1.

FIG. 2b is a cross-sectional view of a magnetic connector moduleaccording to some other embodiments, where the cross-section is takenalong line A-A′ of a thin film-type magnetic connector illustrated inFIG. 1.

FIG. 2c is a cross-sectional view of a magnetic connector moduleaccording to yet other embodiments, where the cross-section is takenalong a line A-A′ of a thin film-type magnetic connector illustrated inFIG. 1.

FIG. 3 is a top-down view of a first side of the thin film-type magneticconnector module of with the magnet inserted, according to someembodiments.

FIG. 4 a top-down view of a first side of the thin film-type magneticconnector module with the magnet removed, according to some embodiments.

FIG. 5 is an illustration of a thin film-type magnetic connector moduleconfigured to be connected with a device case in operation, according tosome embodiments.

FIGS. 6a and 6b show different arrangements of holes formed through wingsections of magnetic connector modules in accordance with variousembodiments.

FIG. 7 is an operational illustration of an external socket sectionbuilt on a surface of a device case and charging bracket that has beenconnected to the thin film-type magnetic connector module, according toembodiments.

FIG. 8 is a perspective view of a thin film-type magnetic connectormodule according to some embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

To address the aforementioned limitations of existing connectortechnologies, some technologies employ magnetic connectors.

In order to prevent this inconvenience and damage to the socket,magnetic connectors utilizing the magnetism is in development and use.

For example, in Korea Registered Patent No. 1204510, the patternelectrode section which is connected to the central hole of the devicecase is in a concentric circular shape on one side of the circularboard, magnet no. 1 is internally located in the aforementioned patternelectrodes, and a spacer is equipped between the aforementioned patternelectrodes and the magnet no. 1.

Also, the brackets are equipped with pin sockets that make contact withthe aforementioned pattern electrodes and the magnet no. 3 is located inthe internals of the pin sockets, creating an electric connectionbetween the aforementioned pattern electrodes and the pin socketsthrough magnetism between magnet no. 1 and magnet no. 3.

As detailed in such reference documents, the circular board on which thepattern electrodes are built, spacer and magnet no. 1 are applicable tothe magnetic connector module used to supply power to mobile devicesetc.

However, if the magnetic connector module is built as in the abovereference document, the thickness of the connection module can onlyincrease due to the width of the spacer and magnet no. 1, and as aresult when connecting the magnetic connector module as detailed in thereference document with a device, limitations on the location of thedevice being connected in unavoidable.

Below various details of the magnetic connector module, e.g., a thinfilm-type magnetic connector module, in accordance with some embodimentswill be explained through the drawings. The same reference numbers onthe attached drawings specify the same component.

FIG. 1 is the blueprint of the structure of the thin film-type magneticconnector module in accordance with some embodiments, FIG. 2a is thefirst operational example of the cross-section of the thin film-typemagnetic connector module divided by line A-A′ on FIG. 1, FIG. 2b is thesecond operational example of the cross-section of the thin film-typemagnetic connector module divided by line A-A′ on FIG. 1, FIG. 2c is thethird operational example of the cross-section of the thin film-typemagnetic connector module divided by line A-A′ on FIG. 1. FIG. 3 is therear view of the thin film-type magnetic connector module's firstoperational example shown in FIG. 2a , FIG. 4 shows the electrodesection on the base surface of the concave section in accordance withthe operational example of some embodiments. FIG. 5 is an exampledrawing of the thin film-type magnetic connector module being connectedwith the device case in accordance with the operational example of someembodiments. FIGS. 6a and 6b shows the arrangement of holes located onthe wing section in accordance with the operation example of someembodiments. FIG. 7 is an example drawing of the external socket sectionbuilt on the surface of the device case and charging bracket that hasbeen connected to the thin film-type magnetic connector module. FIG. 8is the cross-section of a different operational example of the electrodesection of the thin film-type magnetic connector module in accordancewith some embodiments.

The operational examples of the thin film-type magnetic connector module1 in accordance with some embodiments as shown in FIG. 1 to FIG. 4include a board 100, a magnet 200 and a coating layer 300, and on onesurface of the board 100 a connection socket section 400 and wingsection 500 is formed for physical attachment to a back cover of mobiledevices, device case etc. of various devices.

According to various embodiments, the board 100 is formed of a materialsuitable for forming electrodes, e.g., printed electrodes, on itssurface, such as a substrate for a printed circuit board (PCB). Thus, athin-film as described herein refers to a thickness comparable to orthinner than a printed circuit board (PCB) substrate.

One side of the board 100 is internally equipped with the concavesection 110, and the magnet 200 is inserted into the aforementionedconcave section 110. In the illustrated embodiment, the opposite side ofthe board 100 is planar. In some embodiments, only one magnet 200 isinserted. In other embodiments, a plurality of magnets can be inserted.In some embodiments, the magnet 200 is substantially flat and circular,e.g., coin-shaped, and has a thickness smaller than the board 100, whichcan be, e.g., a PCB board.

Referring to FIGS. 1-4, the base surface 115 of the concave section 110on one side of the board 100 is equipped with an electrode section 120comprising multiple electrodes 121˜124, and the other side of the board100 is likewise equipped with an electrode section 130 comprisingmultiple electrodes 131˜134.

By way of example, the electrode section 130 built on the other side ofthe board can include one or more a power socket (131 (e.g., v+), 134(e.g., GND)) and a data socket (132 (e.g., D+), 133 (e.g., D−)), and theelectrode section 120 on the base surface can include a power socket(121 (e.g., v+), 124 (e.g., GND)) and a data socket (122 (e.g., D+), 123(e.g., D−)). The power socket (131, 134) and the data socket (132, 133)of the electrode section 130 correspond to the power socket (121, 124)and the data socket (122, 123) of the electrode section 120. However, itwill be appreciated that the sockets forming electrode sections 120 and130 are not limited to a power socket and a data socket, and can beequipped with other sockets, e.g., SIG sockets used to check contactwith an external socket section, among other sockets.

According to the attached drawings, both the electrode section 130equipped on the other side of the board 100 and the electrode section120 on the base surface 115 is shown in the shape of a concentriccircle, but the electrode sections 120 and 130 can be built in variousshapes and the electrode sections 120 and 130 do not need to beidentical in shape.

The board 100 is equipped with a board hole 140 used to electricallyconnect the electrode sections 120 and 130 built on the other side ofthe board 100 and on the base surface 115.

The board hole 140 is created more than once on electrodes 131˜134located on the electrode section 130 on the other side of the board 100,and is penetrated up to electrodes 121˜124 composing the electrodesection 120 on the base surface 115.

Also, the inside of the board holes 140 have conductors formed through,e.g., coated or filled with a conductive material, such that theelectrode sections 120 and 130, formed on each the base surface 115 andthe other side of the board 100, respectively, are electricallyconnected to each other.

At this instance, the electrode section 120 built on the base surface115 can be connected to the connection socket section 400 built on oneside of the board 100, as shown in FIG. 4. Each socket in the connectionsocket section 400 can be connected to the lead wire (not shown), andthrough such connection sockets 400 the connection between the lead wireand the electrode section 120 can be achieved easily.

As one way some of the present embodiments can be used, FIG. 5 shows anexample of the connector module 1 being connected with a device case 2,e.g., a back cover of a mobile device, e.g., a smart phone, and morespecifically the drawing shows after forming a penetration hole 20 inthe center of the device case 2 it can be used as a connector to themobile device by attaching the connector module 1 to the aforementionedpenetration hole 20.

After the connector module 1 is connected with the device case 2 inaccordance with the embodiments, it is desirable for there to be minimumtopography resulting from height differences, on either side of thedevice case 2. Thus, in various embodiments, the thickness of the board100 is substantially similar or the same as the thickness of the devicecase 2. Thus, in some embodiments, at least one surface of the connectormodule 1 (e.g., the surface corresponding to the electrode section 130)is flush against the corresponding surface of the case 2. That is, thesurface of the board 100 having the electrode section 130 forms asubstantially coplanar surface with an external surface of the case 2

However, FIG. 5 just shows one operational form of the connector module1 connecting with the device case 2, and the connector module 1 can beconnected to various other devices.

As shown in FIG. 5, when connecting the connector module 1 with thedevice case 2, in accordance with the board 100 being inserted into thepenetration hole 20 on the device case 2, the wing section 500 ispressed up against one side of the device case 2 and can be used tofasten the connector module 1 on the device case 2.

The wing section 500 in the attached drawings is shown as a square shapewith rounded corners, but the wing section 500 is not limited in itsshape and can be built as a rectangular or circular shape.

In some embodiments, the wing section 500 can be formed as an integralpiece which expands from one side of the board 100 by modifying (e.g.,deforming to form the concave section) the board 100 when building theconnector module 1. In these embodiments, the wing section 500 and theboard 100 is formed of the same material, e.g., a PCB substrate.

In some other embodiments, the wing section 500 can be formed separatelyand attached afterwards. When formed separately and attached to theboard 100 afterwards, the wing section 500 can be formed of a materialdifferent from the board, including, e.g., plastic, alloy, metal, etc.

On the other hand, FIG. 2 is the first operational example of thecross-section of the thin film-type magnetic connector module divided byline A-A′ of FIG. 1, and according to this figure the wing section 500is equipped on one side of the board 100, but it is not shown to beequipped on the concave section 110 where the magnet 200 is located.

However, as shown in the second operational example showing thecross-section of the connector module in FIG. 2b , the wing section 500can be built to cover the magnet 200 inserted into the concave section110.

Because the board 100 according to embodiments are configured to receivethe magnet 200 into the concave section 110 built on one side of theboard 100, it is preferable to have a magnet that is thin, and thereforethere may be a need to strengthen the magnetic coupling force of themagnet 200, or to increase the are over which the magnetic couplingforce is exerted.

As one suggestion in strengthening the magnetism of the magnet, the wingsection 500, made of metallic materials, could be attached to one sideof the board 100 and as shown in FIG. 2b , the wing section 500 could bemade to cover the magnet 200 inserted into the concave section 110.

And in this instance, the area of the wing section 500 closest to oneside of the magnet 200 becomes larger than the area of the coating layer300 closet to the other side of the magnet 200 or the area of the basesurface 115. The magnetic flux density of the magnet 200 is inverselyproportional to the area of the side which the magnet 200 is theclosest; the magnetic flux density from the magnet 200 to the other sideof the circuit 100 will become greater than the magnetic flux densityfrom the magnet 200 to the wing section 500.

Therefore, in the case of the metallic wing section 500 covering themagnet 200 inserted into the concave section 110, compared to when itdoes not cover the magnet 200 inserted into the concave section 110 asshown in FIG. 2a , the magnetism of the magnet 200 in the direction fromthe magnet 200 to the other side of the circuit 100 will becomestronger.

Also, in another suggestion in strengthening the magnetism of the magnet200, by pressing a separate metallic sheet 600 against the lower area ofthe wing section 500 as shown in FIG. 2c , the wing section 500 can bemade to cover the magnet 200 inserted into the concave section 110.

Similarly, when additionally adding a metallic sheet 600 to cover themagnet 200 inserted into the concave section 110, compared to FIG. 2awhere there is no metallic sheet, the magnetism of the magnet 200directed from the magnet 200 to the other side of the board 100 willbecome stronger, and in this instance, the metallic sheet 600 does notneed to cover the whole area of the wing section 500.

In some embodiments, the magnet 200 has a thickness, the concave section110 of the board 100 has a depth, and the wing section 500 has athickness such that the magnet 200 does not protrude above an outermajor surface of the wing section 500.

However, because the magnetic flux density from the magnet 200 to theother side of the board 100 increases as the area of the metallic sheet600 increases, the area of the metallic sheet must be determined withthe magnetism strength needed by the connector module 1 inconsideration. Also, in order to avoid the thicknesses of the connectormodule 1 increasing, it is desirable that the metallic sheet be in theform of a thin film.

In addition, to achieve easy connection from the connection socket 400built on one side of the board 100 to the lead wire, a gap in the wingsection 500 where the connection socket 400 is located may be created.

Also, the wing section 500 may be built with multiple hole 550 in orderto fasten the connector module 1 to the device case 2.

As shown in FIG. 5, in the case of connecting the connector module 1 tothe device case 2, the wing section 500 will be pressed up against oneside of the device case 2. In this instance, the connector module 1 canbe attached to the device case 2 through coating the wing section 500 ofthe connector module 1 with adhesives or installing screws or boltsthrough hole 550. In addition, the connector module 1 can be fastened tothe device case 2 by forming projections (not shown) on one side of thedevice case 2 and inserting them into the multiple hole 550, then byfusing the said projections.

In the case of fastening the connector module 1 with the device case 2by a single hole 550 located on the wing section 500, the connectormodule 1 and the device case 2 cannot be connected properly. Thereforeit is desirable to form multiple hole 550 on the wing section 500.

At this instance, it is desirable for the multiple hole 550 in the wingsection 500 to be symmetrical at the circumference with the center ofthe concave section 110 built on one side of the board 100 as thestandard.

For example, in the case shown in FIG. 6a , if there are 3 hole 550 inthe wing section 500, they should be created at 120° with the concavesection 110 as the center standard, and in the case shown in FIG. 6b ,where there are 4 hole 550 in the wing section 500, they should becreated at 90° with the concave section 110 as the center standard.

Similarly, if multiple hole 550 are created with circumferentialsymmetry with the center of the concave section 110 as the centerstandard, the strength received from the device case 2 when fasteningthe connector module 1 by the multiple hole 550 can be distributedevenly, resulting in a stable connection between the connector module 1and the device case 2.

FIG. 7 is an example drawing of the external socket section built on thesurface of the device case and charging bracket that has been connectedto the thin film-type magnetic connector module.

The electrode section 130 built on the other side of the board 100 is,as shown in FIG. 7, built on the same side as the rear side of thedevice case 2, electrically connecting with contact by magnetism fromthe external socket section 30 equipped on an external device.

In this instance, the external device referred to with reference to someembodiments refers to a device capable of supplying external power tothe connection module 1 such as the charging bracket 3 shown in FIG. 7,and the external socket section 30 refers to an external socket that canconnect electrically on contact by the magnetism from the electrodesection 130 equipped on the aforementioned external device.

As mentioned before, the electrode section 130 can be composed of powersocket 131(V+), 134(GND) and the data socket 132(D+), 133(D−).

In this instance, the external socket 30 can be composed of power socket31(V+), 34(GND) and the data socket 32(D+), 33(D−) corresponding to theabove electrode section 130, and in order for the electrode section 130to magnetically connect with the external socket 30, a separate magnet(not shown) is disposed inside the external socket 30. Thus, theexternal socket 30 and the electrode section 130 are configured to beheld in direct physical contact by the magnetic force between then.

Additionally, regarding the shape of the electrode section 130, althoughthe attached blueprint show the electrode section 130 as composed ofpattern electrodes 131˜134 in a concentric circular shape, the saidpattern electrodes 131˜134 do not have to be built in a concentriccircular pattern, and is capable of being patterned into all shapes, aslong as the patterning is consistent, e.g., laterally symmetric.

However, even if the concentric circular pattern electrodes 131˜134 arerotated to a random direction, the electric connection with thecorresponding external socket 30 is maintained.

In this instance, the concept of the concentric circular patternelectrodes 131˜134 includes the scenario of not only forming acontinuous circular pattern, but also forming a non-continuous circularpattern as shown in FIG. 8. However, non-continuous pattern electrodes131˜134 is limited in rotating the connector module 1 during themagnetic contact of the electrode section 130 and the external socket 30through some embodiments, as well as after the contact.

Additionally, it is desirable that the external socket 30 that ismagnetically connected to the concentric circular pattern electrodes131˜134 be an external pin socket equipped with pins on the externaldevice, but it is not limited to this.

However, in the case of the external socket section being an externalpin socket, a section of the external pin socket projects externallythrough the holes created on the charging bracket 3, and is positionedto be corresponding 1:1 to the aforementioned concentric circularpattern electrodes 131˜134.

The magnet 200 is inserted into the concave section 110 built on oneside of the board 100, and magnetically attaches the electrode section130 on the other side of the board 100 with the external socket 30 builton the external device, creating an electric connection between the two.

Similarly, by inserting the magnet 200 to the concave section 110 builton one side of the board 100 and equipping an electrode section 130 onthe other side of the board 100, a thin film-type magnetic connectormodule, the purpose of some embodiments, can be provided.

In this instance, it is desirable that the thickness of the magnet 200being inserted into the concave section 110 is not greater than thedepth from the base surface 115 to one side of the board 100 or from thebase surface 115 to the wing section 500, but it can be greater in orderto strengthen the magnetism of the magnet 200.

However, in the case where the magnet 200 is too thick, for exampleduring the connection of the device case 2 on the mobile device as shownin FIG. 7, the connection with the device may prove difficult due to themagnet 200, and even after connecting, a gap between the device case 2and the mobile device is created. Therefore, the thickness of the magnet200 should be determined with the magnetic power needed by the connectormodule 1 and the operational structure of the connector module 1 inconsideration.

Additionally, the coating layer is created on the base surface 115 ofthe concave section 110.

Because an electrode section 120 is built on the base surface 115 of theconcave section 110, when the magnet 200 is inserted into the concavesection 110 an electric short occurs between the multiple electrodes121˜124 that composes the electrode section 120.

Therefore, in order to prevent an electrical short, some embodiments ofthe present disclosure include a coating layer 300 to provide electricalinsulation between the magnet 200 and the electrode section 120.

In this instance, the coating layer 300 can be created by coating thebase surface 115 of the concave section 110 or by coating the magnet200.

The present invention is not limited to operation examples, has variousapplications, and without breaking from the key points of the presentinvention of which claim has been requested, anyone with generalknowledge in the field of the present invention can perform variousmodifications.

REFERENCE NUMBER EXPLANATION

-   1: Thin Type Magnetic Connector Module-   100: board-   110: concave section-   115: base surface of concave section-   120: electrode section built on the base surface-   130: electrode section built on one side of the board-   140: board hole-   200: magnet-   300: coating layer-   400: connection socket section-   500: wing section-   550: hole-   600: metallic sheet

What is claimed is:
 1. A magnetic connector module, comprising: a boardhaving a concave section formed at a first side, the concave sectionhaving a base surface having formed thereon a plurality of firstelectrodes; a plurality of second electrodes formed at a second side ofthe board opposite the first side and on a rear surface facing away fromthe base surface; a plurality of holes formed through the concavesection and having conductors formed therethrough to electricallyconnect the first electrodes and the second electrodes; a magnetdisposed in the concave section; and an insulating layer interposedbetween the magnet and the first electrodes.